arm64: dts: qcom: sm8650: drop cpu thermal passive trip points

arm64: dts: qcom: sm8650: drop cpu thermal passive trip points

On the SM8650, the dynamic clock and voltage scaling (DCVS) is done in an
hardware controlled loop using the LMH and EPSS blocks with constraints and
OPPs programmed in the board firmware.

Since the Hardware does a better job at maintaining the CPUs temperature
in an acceptable range by taking in account more parameters like the die
characteristics or other factory fused values, it makes no sense to try
and reproduce a similar set of constraints with the Linux cpufreq thermal
core.

In addition, the tsens IP is responsible for monitoring the temperature
across the SoC and the current settings will heavily trigger the tsens
UP/LOW interrupts if the CPU temperatures reaches the hardware thermal
constraints which are currently defined in the DT. And since the CPUs
are not hooked in the thermal trip points, the potential interrupts and
calculations are a waste of system resources.

Drop the current passive trip points and only leave the critical trip
point that will trigger a software system reboot before an hardware
thermal shutdown in the allmost impossible case the hardware DCVS cannot
handle the temperature surge.

Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Link: https://lore.kernel.org/r/20250203-topic-sm8650-thermal-cpu-idle-v4-1-65e35f307301@linaro.org
Signed-off-by: Bjorn Andersson <andersson@kernel.org>